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Thinfilm, Bemis Extend Partnership to Deliver PE in Packaging

Secured additional access to Thinfilm technologies for brand protection applications in flexible packaging, beverage labeling

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By: Bridget Klebaur

Director of Performance + Engagement / Chief Performance Officer, Office of the Commissioner, NYC Department of Design and Construction

Thin Film Electronics announced that the Bemis Company has expanded its partnership agreement with Thinfilm to deliver printed electronics for ultra-high-volume applications. Under the terms of the two-year extension, Bemis has secured additional access to Thinfilm technologies for brand protection applications in flexible packaging and beverage labeling. The extended agreement widens the companies’ previously announced work together in intelligent packaging solutions.

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